This inventor holds 1 USPTO granted patent. Top assignee: Motorola Corporation. Active years: 2009.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2009
Title: Justin R. Wodrich: Innovating Heat Dissipation Solutions
Introduction
Justin R. Wodrich, an inventive mind based in Plantation, Florida, has made a significant contribution to the field of electronics through his patented innovation. His work primarily revolves around enhancing the efficiency of integrated circuits by developing methods to effectively dissipate heat.
Latest Patents
Wodrich holds a patent for a "Method and apparatus for dissipating heat from an integrated circuit." This innovative apparatus is designed to efficiently disperse heat from an integrated circuit to a heat sink. It comprises a nonconductive body with at least two conductive surfaces. One surface is reflowed to a heat-generating lead of the integrated circuit, while the other serves as a contact point for a heat sink. This design allows for the apparatus and integrated circuit to form a package that can be tape and reeled, facilitating easy mounting onto a printed circuit board of a communication device.
Career Highlights
Justin has embarked on a fulfilling career at Motorola Corporation, a renowned company in the electronics and telecommunications sector. His dedication to advancing thermal management in electronic devices has established him as a valued member of the engineering team.
Collaborations
Throughout his career, Wodrich has had the opportunity to collaborate with notable colleagues, including Michael S. Beard and Hal R. Canter. Their combined expertise has contributed to numerous advancements in the field, pushing the boundaries of what's possible in electronic design.
Conclusion
Through his innovative approaches and collaborative spirit, Justin R. Wodrich continues to make significant strides in the realm of electronics. His patented method for heat dissipation not only enhances the performance of integrated circuits but also exemplifies the transformative power of innovation in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
