The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2009
Filed:
Mar. 08, 2006
Justin R. Wodrich, Plantation, FL (US);
Michael S. Beard, Boca Raton, FL (US);
Hal R. Canter, Weston, FL (US);
Anbuselvan Kuppusamy, Plantation, FL (US);
Zalman Schwartzman, Rehovot, IL;
James L. Stephens, Pembroke Pines, FL (US);
Kathleen Farrell, Legal Representative, Wellington, FL (US);
Justin R. Wodrich, Plantation, FL (US);
Michael S. Beard, Boca Raton, FL (US);
Hal R. Canter, Weston, FL (US);
Anbuselvan Kuppusamy, Plantation, FL (US);
Zalman Schwartzman, Rehovot, IL;
James L. Stephens, Pembroke Pines, FL (US);
Kathleen Farrell, legal representative, Wellington, FL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
An apparatus () is provided for dispersing heat from an integrated circuit () to a heat sink (). The apparatus () is formed on a nonconductive body () having at least two conductive surfaces () disposed thereon. One of the conductive surfaces () is reflowed to a heat generating lead of the integrated circuit (), and the other conductive surface () provides a surface for contacting a heat sink (). The apparatus () and integrated circuit provide a package () which can be tape and reeled () for easy mounting to a printed circuit board () of a communication device ().