Motorola Corporation

Justin R Wodrich

James L Stephens

Anbuselvan Kuppusamy

Hal R Canter

Zalman Schwartzman

Kathleen Farrell, Legal Representative

Michael S Beard

An apparatus () is provided for dispersing heat from an integrated circuit () to a heat sink (). The apparatus () is formed on a nonconductive body () having at least two conductive surfaces () disposed thereon. One of the conductive surfaces () is reflowed to a heat generating lead of the integrated circuit (), and the other conductive surface () provides a surface for contacting a heat sink (). The apparatus () and integrated circuit provide a package () which can be tape and reeled () for easy mounting to a printed circuit board () of a communication device ().

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Plantation, FL, United States of America

Justin R Wodrich