Company Filing History:
Years Active: 2013-2023
Title: Jürgen Barthelmes: Innovator in Lead Frame Technology
Introduction
Jürgen Barthelmes is a prominent inventor based in Berlin, Germany. He has made significant contributions to the field of lead frame technology, holding a total of 7 patents. His innovative designs have advanced the efficiency and reliability of electronic components.
Latest Patents
One of Barthelmes' latest patents focuses on lead frame surface finishing. This patent describes a lead frame design that incorporates a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The multilayer coating is designed to compensate for scratches or surface irregularities in the base material while enhancing adhesion between the lead frame, conductive connectors, and the encapsulant. The first layer of the coating is a soft electroplated copper that smooths the surface of the base material. The second layer consists of a thin precious metal that facilitates mechanical coupling between the leads of the lead frame and the conductive connectors. The third layer is the adhesion promotion compound, which aids in the mechanical coupling to the encapsulant surrounding the lead frame.
Career Highlights
Throughout his career, Jürgen Barthelmes has worked with notable companies such as Atotech Deutschland GmbH and STMicroelectronics International N.V. His experience in these organizations has allowed him to refine his expertise in lead frame technology and contribute to various innovative projects.
Collaborations
Some of Barthelmes' coworkers include Din-Ghee Neoh and Robert Rüther. Their collaborative efforts have further enhanced the development of advanced technologies in the field.
Conclusion
Jürgen Barthelmes is a key figure in the innovation of lead frame technology, with a strong portfolio of patents that reflect his expertise and dedication to advancing electronic component design. His work continues to influence the industry and pave the way for future innovations.