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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10867895 B1

PDFFull Text
Date of Patent:
Dec. 15, 2020

Filed:

Sep. 10, 2018

Lead-frame structure, lead-frame, surface mount electronic device and methods of producing same

Applicant:

Atotech Deutschland Gmbh, Berlin, DE;

Inventors:

Din-Ghee Neoh, Berlin, DE;

Jürgen Barthelmes, Berlin, DE;

Assignee:

Atotech Deutschland GmbH, Berlin, DE;

Attorney:

Renner, Otto, Boisselle & Sklar, LLP

Primary Examiner:

Steven M Christopher

Int. Cl.
CPC ...
H01L 23/495 (2006.01); C25D 3/46 (2006.01); C25D 5/02 (2006.01); C25D 5/48 (2006.01); C23C 18/16 (2006.01); C23C 18/42 (2006.01); H01L 23/31 (2006.01); C25D 5/34 (2006.01); C23C 18/54 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); C23C 18/18 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49582 (2013.01); C23C 18/1603 (2013.01); C23C 18/1689 (2013.01); C23C 18/42 (2013.01); C23C 18/54 (2013.01); C25D 3/46 (2013.01); C25D 5/02 (2013.01); C25D 5/34 (2013.01); C25D 5/48 (2013.01); H01L 21/4821 (2013.01); H01L 23/14 (2013.01); H01L 23/3142 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); C23C 18/1614 (2013.01); C23C 18/1893 (2013.01); H01L 23/564 (2013.01);
Abstract

A lead-frame structure having two faces and exposing a treated silver surface on at least one of said two faces, the treated silver surface(s) serving the wire bonding, which lead-frame structure has a surface which, after applying resin to it, has excellent adhesion even under severe testing conditions, such as the IPC/JEDEC J-STD-20 MSL standard, and a surface mount electronic device comprising a lead-frame or lead-frame entity and at least one semiconductor device mounted thereon, wherein the lead-frame or lead-frame entity exposes a treated silver surface on at least one of the two faces thereof, wherein the treated silver surface(s) serve(s) the wire bonding, and wherein a resin is applied to the lead-frame or lead-frame entity, and which surface mount electronic device has excellent adhesion of the surface of the lead-frame or lead-frame entity even under severe testing conditions.

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