Sendai, Japan

Junnosuke Okajima

This inventor holds 1 USPTO granted patent. Top assignees: Keihin Corporation, Tohoku University. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Junnosuke Okajima. Retrieved from https://idiyas.com/inventor/junnosuke-okajima

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Junnosuke Okajima: Innovator in Cooling Technology

Introduction

Junnosuke Okajima is a notable inventor based in Sendai, Japan. He has made significant contributions to the field of cooling technology, particularly through his innovative designs that enhance the efficiency of electronic components.

Latest Patents

Okajima holds a patent for a cooling device that features a heat receiver, a heat discharger, and a circulation flow path. This device is designed to effectively manage the heat generated by electronic components. The heat receiver is equipped with an attachment surface for multiple electronic components, a first flow path that connects to the circulation flow path, and several surface area increasing members that enhance heat dissipation.

Career Highlights

Throughout his career, Okajima has worked with prominent organizations such as Keihin Corporation and Tohoku University. His experience in these institutions has allowed him to refine his skills and contribute to advancements in cooling technologies.

Collaborations

Okajima has collaborated with talented individuals in his field, including Hajime Tsukui and Yusuke Nishimura. These partnerships have fostered innovation and have led to the development of cutting-edge solutions in electronic cooling.

Conclusion

Junnosuke Okajima's work in cooling technology exemplifies the impact of innovative thinking in the electronics industry. His patent and collaborations highlight his commitment to enhancing the performance and reliability of electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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