Tohoku University

Keihin Corporation

Junnosuke Okajima

Shigenao Maruyama

Atsuki Komiya

Yusuke Nishimura

Hajime Tsukui

Takuya Ouchi

A cooling device includes a heat receiver that receives heat of an electronic component via a coolant, a heat discharger that discharges heat of the coolant from the heat receiver, and a circulation flow path through which the coolant flows from the heat receiver to the heat discharger and the coolant flows from the heat discharger to the heat receiver. The heat receiver is provided with an attachment surface to which a plurality of the electronic components are attached, a first flow path that communicates with the circulation flow path, and a plurality of surface area increasing members that communicate with the first flow path and that are provided on a rear surface of the attachment surface corresponding to the plurality of electronic components.

Growing community of inventors

Sendai, Japan

Junnosuke Okajima