The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Mar. 26, 2019
Applicants:

Keihin Corporation, Tokyo, JP;

Tohoku University, Sendai-shi, JP;

Inventors:

Hajime Tsukui, Kakuda, JP;

Yusuke Nishimura, Kakuda, JP;

Takuya Ouchi, Kakuda, JP;

Shigenao Maruyama, Sendai, JP;

Atsuki Komiya, Sendai, JP;

Junnosuke Okajima, Sendai, JP;

Assignees:

KEIHIN CORPORATION, Tokyo, JP;

TOHOKU UNIVERSITY, Sendai-Shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20309 (2013.01); H05K 7/20318 (2013.01);
Abstract

A cooling device includes a heat receiver that receives heat of an electronic component via a coolant, a heat discharger that discharges heat of the coolant from the heat receiver, and a circulation flow path through which the coolant flows from the heat receiver to the heat discharger and the coolant flows from the heat discharger to the heat receiver. The heat receiver is provided with an attachment surface to which a plurality of the electronic components are attached, a first flow path that communicates with the circulation flow path, and a plurality of surface area increasing members that communicate with the first flow path and that are provided on a rear surface of the attachment surface corresponding to the plurality of electronic components.


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