Albany, NY, United States of America

Junjun Liu


Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2020-2022

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6 patents (USPTO):Explore Patents

Title: Junjun Liu: Innovator in Integrated Circuit Packaging

Introduction

Junjun Liu is a prominent inventor based in Albany, NY (US), known for his contributions to the field of integrated circuit packaging. With a total of 6 patents to his name, Liu has made significant advancements in the design and functionality of integrated circuits.

Latest Patents

Liu's latest patents include an integrated circuit packaging method and an integrated packaging circuit. The integrated circuit packaging method involves circuit layers placed on various surfaces of a substrate, which are connected through holes to circuit pins. A device is positioned on the substrate, with device pins aligning with the connection through holes, allowing for effective electrical connections. Additionally, his integrated circuit packaging structure and method feature a substrate with circuit layers and fine wiring, accommodating multiple chips that are directly connected through fine wiring, enhancing the efficiency of integrated circuits.

Career Highlights

Throughout his career, Junjun Liu has worked with notable companies such as Shenzhen Xiuyuan Electronic Technology Co., Ltd and Shenzhen Xluyuan Electronic Technology Co., Ltd. His experience in these organizations has contributed to his expertise in electronic technology and innovation.

Collaborations

Liu has collaborated with talented individuals in the field, including Chuan Hu and Yuejin Guo, who have contributed to his projects and innovations.

Conclusion

Junjun Liu's work in integrated circuit packaging showcases his innovative spirit and dedication to advancing technology. His patents reflect a commitment to improving electronic design and functionality, making him a noteworthy figure in the field.

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