Junji Shinozaki

Title: Junji Shinozaki: Innovator in Adhesives and Electric Devices

Introduction

Junji Shinozaki is a prominent inventor based in Kanuma, Japan. He has made significant contributions to the field of adhesives and electric devices, holding a total of seven patents. His work focuses on enhancing the performance and reliability of semiconductor chip applications.

Latest Patents

One of Junji Shinozaki's latest patents involves an innovative adhesive for semiconductor chips. This adhesive contains a first resin component that is polymerizable, along with a first hardener that induces a self-polymerization reaction of the first resin component. Additionally, it includes a second hardener that is addition-polymerized with the first resin component. When applied to a wiring board, the adhesive allows for effective bonding between the semiconductor chip and the board when heat is applied. The unique properties of this adhesive ensure that the elastic modulus loss sharply increases at a specific temperature, thereby reducing stress between the semiconductor chip and the wiring board.

Career Highlights

Junji Shinozaki is currently associated with Sony Chemicals Corporation, where he continues to innovate in the field of materials science. His expertise in adhesive technology has positioned him as a key player in the development of advanced electric devices.

Collaborations

Throughout his career, Junji has collaborated with notable colleagues, including Motohide Takeichi and Yukio Yamada. These collaborations have further enriched his research and development efforts.

Conclusion

Junji Shinozaki's contributions to adhesive technology and electric devices have made a significant impact in the industry. His innovative patents reflect his dedication to improving semiconductor applications, showcasing his role as a leading inventor in this field.