The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2003
Filed:
Nov. 14, 2001
Applicant:
Inventors:
Motohide Takeichi, Kanuma, JP;
Junji Shinozaki, Kanuma, JP;
Assignee:
Sony Chemicals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/329 ;
U.S. Cl.
CPC ...
H01L 2/329 ;
Abstract
The present invention is a connection material which enables a flexible circuit board to be connected to a bare IC chip without causing a shoulder touch effect. The connection material contains an insulating adhesive and a flaky or fibrous insulating filler dispersed therein is used for connecting a film-like flexible circuit board and a bare IC chip. The aspect ratio of the flaky or fibrous insulating filler is no less than 20.