Company Filing History:
Years Active: 1988-1999
Title: The Innovations of Junji Ishikawa
Introduction
Junji Ishikawa is a prominent inventor based in Nagoya, Japan. He has made significant contributions to the field of electroless copper plating and semiconductor technology. With a total of 8 patents to his name, Ishikawa's work has had a lasting impact on various industries.
Latest Patents
One of his latest patents is an electroless copper plating solution and process for the formation of copper. This invention discloses a plating solution that includes a copper ion, a copper ion-complexing agent, a reducing agent, and a pH-adjusting agent. The solution utilizes a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator, which enhances the copper deposition speed. Additionally, it incorporates an iron ion compound as a reaction initiator and various compounds to improve the physical properties of the plating film. Another notable patent is for a semiconductor element-mounting printed board. This board features a substrate with a low thermal expansion coefficient, a buffer layer, and a conductor circuit, all designed to effectively bond semiconductor elements.
Career Highlights
Junji Ishikawa is associated with Nippondenso Co., Ltd., where he has been instrumental in advancing technology related to his patents. His innovative approaches have contributed to the development of more efficient manufacturing processes in the electronics sector.
Collaborations
Ishikawa has worked alongside notable colleagues such as Nobumasa Ishida and Koji Kondo. Their collaborative efforts have further enhanced the quality and applicability of their inventions.
Conclusion
Junji Ishikawa's contributions to the fields of electroless copper plating and semiconductor technology exemplify the spirit of innovation. His patents continue to influence advancements in these critical areas of technology.