The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 1989
Filed:
Sep. 01, 1987
Applicant:
Inventors:
Ryoichi Narita, Obu, JP;
Toshio Sonobe, Okazaki, JP;
Hitoshi Ito, Kariya, JP;
Junji Ishikawa, Nagoya, JP;
Osamu Takenaka, Kariya, JP;
Junji Sugiura, Toyota, JP;
Assignee:
Nippondenso Co., Ltd., Aichi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; B32B / ; B32B / ; C08F / ; C08F / ; C08G / ;
U.S. Cl.
CPC ...
357 72 ; 357 74 ; 428413 ; 428447 ; 525477 ; 525504 ; 525131 ;
Abstract
A semiconductor element mounted on a substrate is sealed with a silicone gel which has a complex modulus of elasticity such that breakage of solder bumps due to thermal fatique occurs preferentially by shear stress thereto due to a difference between thermal expansion coefficients of the semiconductor element and the substrate, not by tension thereto due to thermal expansion of the silicone gel between the semiconductor element and the substrate.