The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 1990

Filed:

Mar. 20, 1989
Applicant:
Inventors:

Koji Kondo, Chiryu, JP;

Katuhiko Murakawa, Obu, JP;

Kaoru Nomoto, Okazaki, JP;

Futoshi Ishikawa, Nagoya, JP;

Nobumasa Ishida, Chiryu, JP;

Junji Ishikawa, Nagoya, JP;

Assignee:

Nippondenso Co., Ltd., Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C / ; B05D / ;
U.S. Cl.
CPC ...
106-123 ; 106-105 ; 106-118 ; 106-126 ; 427305 ; 427 98 ; 204 521 ;
Abstract

A practically fast electroless copper plating solution is provided by adding a specific monoamine as an accelerator. The accelerator should be a tertiary monoamine and cannot be a diamine, does not have a complexing ability for copper ion, and does not contain a ketone or carboxyl group or an unsaturated group. Specific examples of such monoamines include triethylamine, tripropylamine, tribenzylamine, N-methylpiperidine, and diethylaminoethanol.


Find Patent Forward Citations

Kondo, Koji. (1990). Electroless copper plating solution (U.S. Patent No. 4956014). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4956014

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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