Location History:
- Tochigi, JP (2001 - 2014)
- Kanuma, JP (2013 - 2014)
- Tokyo, JP (2018 - 2020)
Company Filing History:
Years Active: 2001-2020
Title: The Innovations of Junichiro Sugita
Introduction
Junichiro Sugita is a prominent inventor based in Tochigi, Japan. He has made significant contributions to the field of thermally conductive materials, holding a total of 10 patents. His work focuses on enhancing the performance and efficiency of thermal management solutions.
Latest Patents
One of Sugita's latest patents is a thermally conductive sheet that features an adhesive thermally conductive layer stacked with a non-adhesive resin layer. The adhesive layer is composed of an acrylic resin cured with a thermally conductive filler, exhibiting a glass transition temperature ranging from -80 to 15°C. The tack property of this layer surpasses that of the non-adhesive resin layer, which has a tack property between 6 to 30 kN/m² and a glass transition temperature from 60 to 110°C. The adhesion properties are measured under specific conditions, ensuring optimal performance. Another notable patent is for a multilayer heat-conductive sheet, which prevents peeling due to interfacial fracture between the tack-free layer and the heat-conductive layer. This innovation utilizes an inorganic filler in a thermoplastic resin to create concaves and convexes on the adhesive surface, enhancing adhesion without compromising the opposite surface.
Career Highlights
Sugita has worked with notable companies such as Dexerials Corporation and Sony Chemical & Information Device Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas in thermal management technologies.
Collaborations
Some of his coworkers include Keisuke Aramaki and Morio Sekiguchi. Their collaboration has contributed to the advancement of Sugita's projects and innovations.
Conclusion
Junichiro Sugita's work in thermally conductive materials showcases his expertise and dedication to innovation. His patents reflect a commitment to improving thermal management solutions, making significant strides in the industry.