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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10550296 B1

PDFFull Text
Date of Patent:
Feb. 04, 2020

Filed:

Mar. 26, 2014

Thermally conductive sheet

Applicant:

Dexerials Corporation, Tokyo, JP;

Inventor:

Junichiro Sugita, Tokyo, JP;

Assignee:

DEXERIALS CORPORATION, Tokyo, JP;

Attorney:

Procopio, Cory, Hargreaves & Savitch LLP

Primary Examiner:

Frank D Ducheneaux

Int. Cl.
CPC ...
C09J 133/08 (2006.01); C09J 9/00 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C09J 7/22 (2018.01); C09J 7/30 (2018.01); C09J 7/38 (2018.01); C09J 4/00 (2006.01); C09K 5/14 (2006.01); C08K 3/013 (2018.01); C08K 3/20 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 3/34 (2006.01); C08K 3/38 (2006.01); C08K 3/04 (2006.01); B32B 27/30 (2006.01); B32B 27/40 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01); B32B 7/12 (2006.01); B32B 27/22 (2006.01); C08K 5/11 (2006.01); H01L 21/683 (2006.01); H01L 23/373 (2006.01); C08K 3/08 (2006.01); C08F 220/18 (2006.01);
U.S. Cl.
CPC ...
C09J 133/08 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/22 (2013.01); B32B 27/308 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); C08K 3/041 (2017.05); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 3/34 (2013.01); C08K 3/38 (2013.01); C08K 5/11 (2013.01); C09J 7/22 (2018.01); C09J 7/30 (2018.01); C09J 7/38 (2018.01); C09J 9/00 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09K 5/14 (2013.01); B32B 2307/302 (2013.01); B32B 2457/00 (2013.01); C08F 220/18 (2013.01); C08K 3/013 (2018.01); C08K 2003/085 (2013.01); C08K 2003/0806 (2013.01); C08K 2003/222 (2013.01); C08K 2003/2224 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/001 (2013.01); C08L 2203/204 (2013.01); C09J 4/00 (2013.01); C09J 2201/606 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2431/006 (2013.01); C09J 2433/00 (2013.01); C09J 2467/006 (2013.01); C09J 2475/006 (2013.01); H01L 21/6836 (2013.01); H01L 23/3735 (2013.01); H01L 23/3737 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A thermally conductive sheet in which an adhesive thermally conductive layer and a non-adhesive resin layer are stacked. The adhesive thermally conductive layer includes an acrylic resin formed by curing an acrylic compound and a thermally conductive filler, a glass transition temperature of the acrylic resin is from −80 to 15° C., a tack property of the adhesive thermally conductive layer is higher than a tack property of the non-adhesive resin layer, the tack property of the non-adhesive resin layer is from 6 to 30 kN/m2. The non-adhesive resin layer has a glass transition temperature from 60 to 110° C. The tack property is measured by pressing probe on a layer and peeling the probe under conditions of pressing speed of 30 mm/min, peeling speed of 120 mm/min, load of 196 g, pressing time of 5.0 sec, pulling distance of 5 mm, probe heating of 40° C. and sheet stage heating of 40° C.

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