Company Filing History:
1 out of 10,250 
1 out of 92 Years Active: 2014
Title: Junichiro Nishikawa: Innovator in Printed Wiring Board Technology
Introduction
Junichiro Nishikawa is a notable inventor based in Kouga, Japan. He has made significant contributions to the field of printed wiring board technology. His innovative approach has led to the development of a unique patent that enhances the functionality and efficiency of printed wiring boards.
Latest Patents
Nishikawa holds a patent for a printed wiring board and the method for manufacturing the same. This invention includes a metallic substrate, an insulating layer on the surface of the metallic substrate, and a conductive layer formed on the insulating layer. The conductive layer is electrically connected to the metallic substrate. A bottomed via hole or a through hole is formed in both the insulating layer and the conductive layer. The via hole has a bottom in the metallic substrate and a wall surface in the insulating layer and conductive layer. The through hole extends through all layers. Conductive paste fills the bottomed via hole or the through hole to create an electrical connection between the metallic substrate and the conductive layer. The printed wiring board undergoes a process where current is applied to the interface between the metallic substrate and the conductive paste.
Career Highlights
Throughout his career, Junichiro Nishikawa has worked with prominent companies such as Sumitomo Electric Industries, Limited and Sumitomo Electric Printed Circuits, Inc. His experience in these organizations has allowed him to refine his skills and contribute to advancements in technology.
Collaborations
Nishikawa has collaborated with notable individuals in his field, including Yoshio Oka and Jinjoo Park. These partnerships have fostered innovation and have been instrumental in the development of new technologies.
Conclusion
Junichiro Nishikawa's contributions to printed wiring board technology exemplify his innovative spirit and dedication to advancing the field. His patent reflects a significant step forward in manufacturing processes, showcasing his expertise and commitment to excellence.