Sumitomo Electric Industries, Limited

Sumitomo Electric Printed Circuits, Inc.

Junichiro Nishikawa

Yoshio Oka

Kazuyuki Maeda

Jinjoo Park

Narito Yagi

Tetsuya Shimomura

The printed wiring boardincludes the metallic substrate, the insulating layerprovided on the surface of the metallic substrate, and the conductive layerformed on the surface of the insulating layer. The conductive layeris electrically connected to the metallic substrate. A bottomed via hole or a through holeis formed in the insulating layerand the conducive layer. The via hole has a bottom in the metallic substrate, and has a wall surface in the insulating layerand in the conductive layer. The through holeextends through the insulating layer, the conductive layer, and the metallic substrate. Conductive pastefills the bottomed via hole or the through holeto electrically connect the metallic substrateand the conductive layerwith each other. The printed wiring boardis subjected to a process in which current is applied to the interface between the metallic substrateand the conductive paste

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Kouga, Japan

Junichiro Nishikawa