Taichung, Taiwan

Jungbae Lee

USPTO Granted Patents = 14 

Average Co-Inventor Count = 1.3

ph-index = 1

Forward Citations = 6(Granted Patents)


Location History:

  • Boise, ID (US) (2023)
  • Taichung, TW (2021 - 2024)

Company Filing History:


Years Active: 2021-2025

Loading Chart...
14 patents (USPTO):Explore Patents

Title: Innovations of Jungbae Lee in Semiconductor Technology

Introduction

Jungbae Lee is a prominent inventor based in Taichung, Taiwan, known for his significant contributions to semiconductor technology. With a total of 14 patents to his name, he has made remarkable advancements in the field, particularly in the design and assembly of semiconductor devices.

Latest Patents

Among his latest patents, Jungbae Lee has developed innovative methods for stacked semiconductor dies for semiconductor device assemblies. These patents detail a semiconductor die assembly that includes a substrate with an opening extending through it. The assembly features a stack of semiconductor dies attached to the substrate, with the first die aligned with the opening. The second die extends past the edge of the first die, allowing for efficient coupling of bond pads through the substrate. This design enhances the functionality and efficiency of semiconductor devices.

Career Highlights

Jungbae Lee is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His work focuses on advancing semiconductor technology, contributing to the development of cutting-edge solutions that meet the demands of modern electronics.

Collaborations

Throughout his career, Jungbae Lee has collaborated with notable colleagues, including Yeongbeom Ko and Youngik Kwon. These partnerships have fostered innovation and have played a crucial role in the success of their projects.

Conclusion

Jungbae Lee's contributions to semiconductor technology through his patents and collaborations highlight his expertise and commitment to innovation. His work continues to influence the industry and pave the way for future advancements in semiconductor devices.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…