Jungbae Lee

This inventor holds 15 USPTO granted patents and 7 published patent applications. Top assignee: Micron Technology Incorporated. Active years: 2021-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jungbae Lee. Retrieved from https://idiyas.com/inventor/jungbae-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 15 (Patent Applications = 7)

% Patents Active = 100.0

Average Co-Inventor Count = 1.3

ph-index = 1

Forward Citations = 6(Granted Patents)

Location History:

Boise, ID (US) (2023)
Taichung, TW (2021 - 2024)

Company Filing History:

15 out of 39,253

Micron Technology Incorporated

patents

Years Active: 2021-2026

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15 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12532774 - Conductive organic module for semiconductor devices and associated systems and methods (2026-01-20),

2. 12341128 - Stacked semiconductor dies for semiconductor device assemblies (2025-06-24),

3. 11942455 - Stacked semiconductor dies for semiconductor device assemblies (2024-03-26),

4. 11923332 - Semiconductor die with capillary flow structures for direct chip attachment (2024-03-05),

5. 11887938 - Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the same (2024-01-30),

6. 11810894 - Solderless interconnect for semiconductor device assembly (2023-11-07),

7. 11688706 - Semiconductor device assembly with embossed solder mask having non-planar features and associated methods and systems (2023-06-27),

8. 11682563 - Semiconductor device assembly with graded modulus underfill and associated methods and systems (2023-06-20),

9. 11621245 - Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systems (2023-04-04),

10. 11532595 - Stacked semiconductor dies for semiconductor device assemblies (2022-12-20),

11. 11404289 - Semiconductor device assembly with graded modulus underfill and associated methods and systems (2022-08-02),

12. 11362071 - Stacked semiconductor dies for semiconductor device assemblies (2022-06-14),

13. 11342277 - Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the same (2022-05-24),

14. 11264349 - Semiconductor die with capillary flow structures for direct chip attachment (2022-03-01),

15. 11094668 - Solderless interconnect for semiconductor device assembly (2021-08-17),

Title: Innovations of Jungbae Lee in Semiconductor Technology

Introduction

Jungbae Lee is a prominent inventor based in Taichung, Taiwan, known for his significant contributions to semiconductor technology. With a total of 14 patents to his name, he has made remarkable advancements in the field, particularly in the design and assembly of semiconductor devices.

Latest Patents

Among his latest patents, Jungbae Lee has developed innovative methods for stacked semiconductor dies for semiconductor device assemblies. These patents detail a semiconductor die assembly that includes a substrate with an opening extending through it. The assembly features a stack of semiconductor dies attached to the substrate, with the first die aligned with the opening. The second die extends past the edge of the first die, allowing for efficient coupling of bond pads through the substrate. This design enhances the functionality and efficiency of semiconductor devices.

Career Highlights

Jungbae Lee is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His work focuses on advancing semiconductor technology, contributing to the development of cutting-edge solutions that meet the demands of modern electronics.

Collaborations

Throughout his career, Jungbae Lee has collaborated with notable colleagues, including Yeongbeom Ko and Youngik Kwon. These partnerships have fostered innovation and have played a crucial role in the success of their projects.

Conclusion

Jungbae Lee's contributions to semiconductor technology through his patents and collaborations highlight his expertise and commitment to innovation. His work continues to influence the industry and pave the way for future advancements in semiconductor devices.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

7 patents pending: