The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2022
Filed:
Mar. 02, 2021
Micron Technology, Inc., Boise, ID (US);
Jungbae Lee, Taichung, TW;
Micron Technology, Inc., Boise, ID (US);
Abstract
Stacked semiconductor dies for semiconductor device assemblies and associated methods and systems are disclosed. In some embodiments, the semiconductor die assembly includes a substrate with an opening extending therethrough. The assembly can include a stack of semiconductor dies attached to the substrate. The stack includes a first die attached to a front surface of the substrate, where the first die includes a first bond pad aligned with the opening. The stack also includes a second die attached to the first die such that an edge of the second die extends past a corresponding edge of the first die. The second die includes a second bond pad uncovered by the first die and aligned with the opening. A bond wire formed through the opening couples the first and second bond pads with a substrate bond pad on a back surface of the substrate.