Tianjin, China

Jun Li

USPTO Granted Patents = 7 


Average Co-Inventor Count = 4.4

ph-index = 2

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2013-2024

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7 patents (USPTO):Explore Patents

Title: Innovations of Jun Li in Semiconductor Technology

Introduction

Jun Li is a prominent inventor based in Tianjin, China, known for his contributions to semiconductor technology. He holds a total of 7 patents, showcasing his innovative approach to improving electronic components and packaging.

Latest Patents

Among his latest patents, Jun Li has developed a lead-frame assembly for semiconductor dies. This assembly includes a die attach pad and a plurality of elongate leads, designed to enhance adhesion and performance. Each elongate lead features a coating-free portion and a coated portion, optimizing the connection between the die and the leads. Additionally, he has patented an integrated circuit package that reduces bond wire defects. This package is formed by strategically positioning an integrated circuit die on a leadframe and encapsulating it with a specialized material, ensuring durability and reliability.

Career Highlights

Jun Li has worked with notable companies in the semiconductor industry, including NXP USA, Inc. and Freescale Semiconductor, Inc. His experience in these organizations has significantly contributed to his expertise and innovative capabilities in the field.

Collaborations

Jun Li has collaborated with talented individuals such as Jinzhong Yao and Xuesong Xu, further enhancing his work and contributions to semiconductor technology.

Conclusion

Jun Li's innovative patents and career in semiconductor technology highlight his significant impact on the industry. His work continues to influence advancements in electronic components and packaging solutions.

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