The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2020
Filed:
Mar. 28, 2019
Applicant:
Nxp Usa, Inc., Austin, TX (US);
Inventors:
Meijiang Song, Tianjin, CN;
Allen Marfil Descartin, Tianjin, CN;
Mariano Layson Ching, Jr., Tianjin, CN;
Lidong Zhang, Tianjin, CN;
Jun Li, Tianjin, CN;
Assignee:
NXP USA, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4951 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 23/49582 (2013.01);
Abstract
A copper lead frame used in the assembly of a semiconductor device includes a die flag and lead fingers extending away from the die flag. Each lead finger has a proximal end near the die flag and a distal end further away from the die flag. Metal plating is formed on the lead fingers, where first lead fingers have the metal plating on their proximal ends and second lead fingers have the metal plating on their distal ends. The first and second lead fingers are arranged alternately around the die flag.