Nxp Usa, Inc.

Other

Freescale Semiconductor,inc.

Cnpc Bohai Drilling Engineering Company Limited

Li, Jun

Jun Li

Jinzhong Yao

Xuesong Xu

Xingshou Pang

Mariano Layson Ching, Jr

Nan Li

Meng Kong Lye

Zhigang Bai

Lidong Zhang

Jianhong Wang

Da Zheng Li

Meijiang Song

Allen Marfil Descartin

Wanming Yu

Fei Li

Hongjun Li

Zhiyong He

Mingchuan Han

Jian Song

Da Li

Qiang Feng

Yao Wang

Wei Dang

A lead-frame assembly is disclosed, for a semiconductor die and comprising a die attach pad and a plurality of elongate leads spaced apart therefrom; wherein each elongate lead has a first proximal end portion, a second distal end portion and a middle portion therebetween; wherein the die attach pad and each of the plurality of elongate leads each comprise a coating-free portion, and a coated portion having a coating material thereon; wherein a part of a perimeter of the die attach pad proximal each lead is comprised in the coating-free portion, and wherein the proximal end portion of each elongate lead is comprised in the coating-free portion. Associated package assemblies and methods are also disclosed.

Lead-frame assembly, semiconductor package and methods for improved adhesion

An integrated circuit package is formed by positioning an integrated circuit die on a die pad of a leadframe; connecting a bond wire between the die and a bond pad of the leadframe; encapsulating the bond wire, die, and bond pad with an encapsulant material to form a first mold cap of the integrated circuit package; after the encapsulating, bending one or more leads of the leadframe to form one or more bent leads; and encapsulating the first mold cap and a portion of a bend of the one or more bent leads with the encapsulant material to form a second mold cap.

Integrated circuit package and method to manufacture the integrated circuit package to reduce bond wire defects in the integrated circuit package

A copper lead frame used in the assembly of a semiconductor device includes a die flag and lead fingers extending away from the die flag. Each lead finger has a proximal end near the die flag and a distal end further away from the die flag. Metal plating is formed on the lead fingers, where first lead fingers have the metal plating on their proximal ends and second lead fingers have the metal plating on their distal ends. The first and second lead fingers are arranged alternately around the die flag.

Lead frame with selective patterned plating

A lead frame for a packaged integrated circuit (IC) device has alternating first and second leads that protrude from a package body in respective first and second planes, where the second plane is parallel to and below the first plane. The first leads are formed into Gull Wing shaped leads and the second leads are formed into J-shaped leads. Inner lead portions of the first and second leads are maintained in the first plane with a tape. An inner lead portion of each of the second leads, proximate to and extending to the outer lead portion, is down-set, so that when the outer lead portion is pressed down by a mold tool to locate the outer lead portion of the second leads in the second plane, the inner lead portion of the second leads is maintained in the first plane and does not separate from the tape.

Lead frame for integrated circuit device having J-leads and Gull Wing leads

The present disclosure relates to a portable mop and a mop bucket used with the portably mop. The portable mop includes a mop rod (). The mop rod () is provided with a steering mechanism (). The steering mechanism () includes a sleeve nut (), a locking thread sleeve () and a hinged ladder rotating shaft (). A hinge plane () is arranged at the upper end of the hinged ladder rotating shaft (). The mop bucket includes an integrated squeezing and brushing device is formed by the connection of the squeezing roller pair and the brush body by virtue of a combined support; the combined support comprises a left and a right side baffles; and the brush body is fixedly connected with the squeezing roller pair through connecting screw rods to form a whole.

Lightweight mop and mop bucket used therewith

A multi-level sliding sleeve including an outer cylinder, an inner sliding sleeve, a combined ball socket, a guider, an expander, an upper gland, a lower gland, and a ball. The outer cylinder includes internal threads in an upper end and external threads in a lower end, and the outer cylinder including an external wall including a plurality of drainage holes along the peripheral direction. The inner sliding sleeve is mounted to an inner wall of the outer cylinder through shear pins. The inner sliding sleeve includes a plurality of square holes in the middle along the peripheral direction, each of which is equipped with a ball socket inside. The ball sockets combine together to form a combined ball socket. The combined ball socket is equipped with the guider in the upper end and the expander in the lower end.

Multi-level sliding sleeve

A method of assembling a magnetoresistive random access memory (MRAM) device includes providing a substrate having an opening. A tape is applied to a surface of the substrate and a first magnetic shield is placed onto the tape and within the substrate opening. An adhesive is applied between the first magnetic shield and the substrate to attach the first magnetic shield to the substrate. An MRAM die is attached to the first magnetic shield and bond pads of the MRAM die are connected to pads on the substrate with wires. A second magnetic shield is attached to a top surface of the MRAM die. An encapsulating material is dispensed onto the substrate, the MRAM die, the second magnetic shield and part of the first magnetic shield, cured, and then the tape is removed. Solder balls then may be attached to the substrate.

MRAM device and method of assembling same

Growing community of inventors

Tianjin, China

Jun Li