Location History:
- Gunpo-si, KR (2013)
- Gunpo, KR (2017 - 2018)
- Gyeonggi-do, KR (2017 - 2021)
Company Filing History:
4 out of 312 
1 out of 1 
1 out of 8 Years Active: 2013-2021
Title: Innovations of Jun Ki Kim
Introduction
Jun Ki Kim is a notable inventor based in Gunpo, South Korea. He has made significant contributions to the field of nanotechnology and soldering methods. With a total of 5 patents, his work has garnered attention for its innovative approaches and practical applications.
Latest Patents
Among his latest patents is a "Surface-modified boron nitride nanostructure and method for producing same." This invention focuses on forming defects through surface modification and incorporating metallic nanoparticles on the surface defects. Another significant patent is the "Method for filling a wafer via with solder." This invention describes a wafer via solder filling device that includes a solder bath with an accommodation space for molten solder, an air outlet for exhausting air, a fixing unit for sealing the accommodation space, and a pressing unit for moving the molten solder upward to fill the via.
Career Highlights
Jun Ki Kim has worked with esteemed organizations such as the Korea Institute of Industrial Technology and Sin Yeong Co., Ltd. His experience in these institutions has allowed him to refine his skills and contribute to various innovative projects.
Collaborations
He has collaborated with notable coworkers, including Chang Woo Lee and Jeong Han Kim. Their combined expertise has likely enhanced the quality and impact of their projects.
Conclusion
Jun Ki Kim's contributions to the fields of nanotechnology and soldering methods demonstrate his innovative spirit and dedication to advancing technology. His patents reflect a commitment to solving complex problems through inventive solutions.