The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2013
Filed:
Dec. 30, 2009
SE Hoon Yoo, Incheon, KR;
Chang Woo Lee, Anyang-si, KR;
Jun Ki Kim, Gunpo-si, KR;
Jeong Han Kim, Seoul, KR;
Cheol Hee Kim, Incheon, KR;
Young Ki Ko, Incheon, KR;
Yue Seon Shin, Seoul, KR;
Se Hoon Yoo, Incheon, KR;
Chang Woo Lee, Anyang-si, KR;
Jun Ki Kim, Gunpo-si, KR;
Jeong Han Kim, Seoul, KR;
Cheol Hee Kim, Incheon, KR;
Young Ki Ko, Incheon, KR;
Yue Seon Shin, Seoul, KR;
Korea Institute of Industrial Technology, Cheonan-si, Chungnam, KR;
Abstract
A device of filling metal in a through-via-hole formed in a semiconductor wafer and a method of filling metal in a through-via-hole using the same are disclosed. A device of filling metal in a through-via-hole formed in a semiconductor wafer includes a jig base comprising a jig configured to fix the wafer having the through-via-hole formed therein; a upper chamber 120 installed on the jig base; a lower chamber installed under the jig base; a heater installed in the upper chamber, the heater configured to apply heat to filling metal placed on the wafer to melt the filling metal; and a vacuum pump configured to generate pressure difference between the upper chamber and the lower chamber by the pressure of the lower chamber reduced by discharging air of the lower chamber 130 outside, only to fill the melted filling metal in the through-via-hole.