Company Filing History:
Years Active: 2013-2018
Title: Young Ki Ko: Innovator in Wafer Solder Filling Technology
Introduction
Young Ki Ko is a prominent inventor based in Incheon, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the area of wafer solder filling. With a total of 3 patents to his name, Ko's work is recognized for its innovative approaches and practical applications.
Latest Patents
Young Ki Ko's latest patents include a method and apparatus for filling a wafer via with solder. The first patent describes a wafer via solder filling device that features a solder bath with an accommodation space for molten solder. This device includes an open top and an air outlet for exhausting air from the accommodation space. It also has a fixing unit that secures the wafer with a via formed in one surface, sealing the accommodation space airtight. Additionally, a pressing unit is incorporated to press the molten solder and move it upward, effectively filling the via. The second patent mirrors the first, emphasizing the innovative design and functionality of the solder filling device.
Career Highlights
Young Ki Ko is affiliated with the Korea Institute of Industrial Technology, where he continues to advance his research and development efforts. His work has been instrumental in enhancing the efficiency and effectiveness of solder filling processes in semiconductor manufacturing.
Collaborations
Ko collaborates with notable colleagues, including Chang Woo Lee and Jun Ki Kim, who contribute to his research initiatives and projects.
Conclusion
Young Ki Ko stands out as a key figure in the field of wafer solder filling technology. His innovative patents and contributions to the Korea Institute of Industrial Technology highlight his commitment to advancing semiconductor technology.