The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2017
Filed:
Jul. 10, 2012
Sehoon Yoo, Incheon, KR;
Chang Woo Lee, Anyang, KR;
Jun Ki Kim, Gunpo, KR;
Jeong Han Kim, Seoul, KR;
Young Ki Ko, Incheon, KR;
Sehoon Yoo, Incheon, KR;
Chang Woo Lee, Anyang, KR;
Jun Ki Kim, Gunpo, KR;
Jeong Han Kim, Seoul, KR;
Young Ki Ko, Incheon, KR;
KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY, Cheonan, KR;
Abstract
A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.