Company Filing History:
Years Active: 2017-2018
Title: Sehoon Yoo: Innovator in Wafer Solder Filling Technology
Introduction
Sehoon Yoo is a prominent inventor based in Incheon, South Korea. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of wafer solder filling technology. With a total of 2 patents, his work has garnered attention for its innovative approaches to improving manufacturing processes.
Latest Patents
Sehoon Yoo's latest patents include a "Method for filling a wafer via with solder" and an "Apparatus for filling a wafer via with solder." Both patents describe a wafer via solder filling device that features a solder bath with an accommodation space for molten solder. The device includes a fixing unit to securely hold the wafer in place and a pressing unit that moves the molten solder upward to fill the via effectively. These inventions aim to enhance the efficiency and reliability of solder filling in semiconductor applications.
Career Highlights
Sehoon Yoo is affiliated with the Korea Institute of Industrial Technology, where he has been instrumental in advancing research and development in industrial technologies. His expertise in solder filling processes has positioned him as a key figure in the semiconductor industry.
Collaborations
Sehoon Yoo has collaborated with notable colleagues, including Chang Woo Lee and Jun Ki Kim. Their combined efforts have contributed to the development of innovative solutions in the field of semiconductor manufacturing.
Conclusion
Sehoon Yoo's contributions to wafer solder filling technology reflect his commitment to innovation and excellence in the semiconductor industry. His patents not only demonstrate his technical expertise but also pave the way for advancements in manufacturing processes.