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For the Inventor, By the Inventor

Annaka, Japan

Jun Horikoshi

USPTO Granted Patents = 16 

 

Average Co-Inventor Count = 1.4

ph-index = 5

Forward Citations = 171(Granted Patents)


Location History:

  • Gunma, JP (1995)
  • Tano-gun, JP (2009)
  • Takasaki, JP (2017)
  • Gunma-ken, JP (2004 - 2018)
  • Annaka, JP (2009 - 2019)

Company Filing History:

goldMedal16 out of 5,967 
 
Shin-etsu Chemical Co., Ltd.
 patents

Years Active: 1995-2019

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16 patents (USPTO):Explore Patents
1. 10353283 - Adhesive for pellicle, pellicle, and method of selecting adhesive for pellicle (2019-07-16),
2. 10126645 - Adhesive suitable for a pellicle for EUV lithography and a pellicle using the same adhesive (2018-11-13),
3. 9977326 - Pellicle for EUV (2018-05-22),
4. 9910349 - Agglutinant for pellicle and a pellicle using it (2018-03-06),
5. 9759996 - Pellicle frame and pellicle (2017-09-12),
6. 9703188 - Agglutinat for pellicle, a pellicle using it and a method for evaluating pellicle (2017-07-11),
7. 9594300 - Pellicle (2017-03-14),
8. 9581896 - Agglutinant for pellicle and a pellicle including the same (2017-02-28),
9. 9341943 - Pellicle for lithography (2016-05-17),
10. 8778569 - Pellicle and a method for making the same (2014-07-15),
11. 7601773 - Room temperature-curable, heat-conductive silicone rubber composition (2009-10-13),
12. 7553901 - RTV silicone rubber composition for electric and electronic part protection, circuit boards, silver electrodes, and silver chip resistors (2009-06-30),
13. 7309733 - Organopolysiloxane composition and electronic part encapsulated therewith (2007-12-18),
14. 6812280 - Organopolysiloxane compositions (2004-11-02),
15. 6740725 - Room temperature curable organopolysiloxane compositions (2004-05-25),

Title: Innovations of Jun Horikoshi

Introduction

Jun Horikoshi is a notable inventor based in Annaka, Japan. He has made significant contributions to the field of adhesive technology, particularly in applications related to pellicles used in lithography.

Latest Patents

Horikoshi holds 16 patents, with his latest innovations focusing on adhesives for pellicles. One of his patents describes an adhesive that comprises substantially no surface modifier and leaves less residue after a pellicle is separated. This adhesive is characterized by a peel strength to tensile strength ratio ranging from 0.10 to 0.33. Another patent proposes a pellicle with an adhesive layer that undergoes a hardness change at a specific rate when exposed to high temperatures. These innovations are particularly suitable for extreme ultraviolet (EUV) lithography.

Career Highlights

Horikoshi has built a successful career at Shin-Etsu Chemical Co., Ltd., where he has been instrumental in developing advanced adhesive solutions. His work has significantly impacted the efficiency and effectiveness of pellicle applications in the semiconductor industry.

Collaborations

Some of his notable coworkers include Tsuneo Kimura and Yu Yanase, who have collaborated with him on various projects within the company.

Conclusion

Jun Horikoshi's contributions to adhesive technology and pellicle innovations have established him as a key figure in his field. His patents reflect a commitment to advancing technology in the semiconductor industry.

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