Jun Higuchi

Title: Jun Higuchi: Innovator in Metal Layer Formation and Copper Plating

Introduction

Jun Higuchi is a prominent inventor based in Berlin, Germany. She has made significant contributions to the field of materials science, particularly in the manufacturing processes of printed circuit boards and semiconductor substrates. With a total of 2 patents, her work focuses on innovative methods that enhance the efficiency and effectiveness of metal layer formation and copper plating.

Latest Patents

Jun Higuchi's latest patents include a "Method of forming a metal layer" and a "Method for copper plating." The first patent describes a process for treating a substrate, such as a printed circuit board, with various chemical solutions to achieve a high-quality metal layer. This process involves multiple sequential treatments, including the use of alkali metal hydroxide solutions and copper electroplating. The second patent outlines a method for copper plating that utilizes a leveller additive with a heterocyclic core, which is particularly effective for filling recessed structures in the manufacturing of printed circuit boards and IC substrates.

Career Highlights

Jun Higuchi is currently employed at Atotech Deutschland GmbH, a company known for its advanced technology in surface finishing and electroplating. Her work at Atotech has allowed her to apply her innovative ideas in a practical setting, contributing to the company's reputation as a leader in the industry.

Collaborations

Throughout her career, Jun has collaborated with notable colleagues, including Dirk Rohde and Bernd Roelfs. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Jun Higuchi's contributions to the field of metal layer formation and copper plating demonstrate her commitment to innovation and excellence. Her patents reflect a deep understanding of materials science and a dedication to improving manufacturing processes.