The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
May. 07, 2012
Applicants:
Dirk Rohde, Berlin, DE;
Bernd Roelfs, Berlin, DE;
Jun Higuchi, Kanagawa, JP;
Inventors:
Assignee:
Atotech Deutschland GmbH, Berlin, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); C25D 7/12 (2006.01); C25D 5/34 (2006.01); H01L 21/288 (2006.01); H05K 3/42 (2006.01); H01L 21/768 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01); C25D 5/34 (2013.01); C25D 7/123 (2013.01); H01L 21/2885 (2013.01); H01L 21/76898 (2013.01); H05K 3/423 (2013.01); H05K 3/187 (2013.01); H05K 2203/0733 (2013.01);
Abstract
A method for copper plating in a plating bath wherein the substrate is brought into contact with a leveller additive comprising a heterocyclic core having a thiol group and an amino group attached to the heterocyclic core by a spacer is disclosed. The method is particularly suitable for filling recessed structures in the manufacture of printed circuit boards, IC substrates and semiconducting substrates.