The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Mar. 12, 2015
Applicant:

Atotech Deutschland Gmbh, Berlin, DE;

Inventors:

Tadahiro Nishigawa, Fukushima, JP;

Jun Higuchi, Berlin, DE;

Hitoshi Ishikawa, Berlin, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/34 (2006.01); C25D 3/38 (2006.01); H05K 3/46 (2006.01); H05K 3/42 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
C25D 5/34 (2013.01); C25D 3/38 (2013.01); H05K 1/0296 (2013.01); H05K 3/424 (2013.01); H05K 3/467 (2013.01); H05K 2201/032 (2013.01);
Abstract

In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, said insulator outer surface and said copper layer outer surface are simultaneously subjected to a process (1) comprising treatment with an alkali metal hydroxide solution, a process (2) comprising treatment with an alkaline aqueous solution containing an aliphatic amine, a process (3) comprising treatment with an alkaline aqueous solution having a permanganate concentration of 0.3 to 3.5 wt % and a pH of 8 to 11, a process (4) comprising treatment with an acidic microemulsion aqueous solution containing a thiophene compound and an alkali metal salt of polystyrenesulphonic acid, and a process (5) comprising copper electroplating, which are implemented sequentially.


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