This inventor holds 4 USPTO granted patents. Top assignees: Foxconn Technology Co., Ltd., Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.. Active years: 2008-2011.
Company Filing History:
4 out of 1,231 
4 out of 778 Years Active: 2008-2011
Title: Innovations of Jun-Hai Li in Heat Dissipation Technology
Introduction
Jun-Hai Li is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of heat dissipation technology, holding a total of 4 patents. His work primarily focuses on developing devices that efficiently manage heat generated by electronic components.
Latest Patents
Among his latest innovations is a heat dissipation device designed for dissipating heat generated from an add-on card equipped with multiple processors. This device features a vapor chamber that thermally contacts the processors, along with a mounting member that secures the vapor chamber to the add-on card using screws. Another notable patent is a heat dissipation device that includes two heat sinks and two heat pipes. Each heat sink consists of a base and a fin group, while the heat pipes connect the heat sinks, ensuring effective heat management.
Career Highlights
Jun-Hai Li has worked with prominent companies in the technology sector, including Fu Zhun Precision Industry (Shenzhen) Co., Ltd. and Foxconn Technology Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects in heat dissipation.
Collaborations
Throughout his career, Jun-Hai Li has collaborated with talented individuals such as Xue-Wen Peng and Bing Chen. These partnerships have fostered a creative environment that has led to the development of advanced heat dissipation solutions.
Conclusion
Jun-Hai Li's contributions to heat dissipation technology highlight his innovative spirit and dedication to improving electronic component performance. His patents reflect a commitment to addressing the challenges of heat management in modern technology.