Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Jun-Hai Li

Xue-Wen Peng

Bing Chen

Rui-Hua Chen

A heat dissipation device is adapted for dissipating heat generated from an add-on card which has a plurality of processors thereon. The heat dissipation device includes a vapor chamber and a mounting member. The vapor chamber thermally contacts with the processors. The mounting member is mounted on a bottom surface of the vapor chamber. A plurality of screws extends through the add-on card and engages with the mounting member to assemble the vapor chamber on the add-on card.

Heat dissipation device

A heat dissipation device for dissipating heat generated from an add-on card. The heat dissipating device includes two heat sinks and two heat pipes connecting with the two heat sinks. Each of the heat sinks includes a base and a fin group mounted on a top surface of the base. Each of the heat pipes includes a connecting section and two heat-conductive sections extending from opposite ends of the connecting section. One of the two heat-conductive sections of each of the heat pipes is sandwiched between the base and the fin group of one heat sink, and another of the two heat-conductive sections is sandwiched between the base and the fin group of another heat sink.

A vapor chamber heat sink attached to a heat-generating electronic component includes a base () defining an opening therein. A plurality of fins () is mounted on the base. A heat pipe () thermally connects the electronic component and the fins. The heat pipe comprises a plate-type lower portion () contacting a bottom surface of the base and a bottom surface () of the fins and overlaying a top surface of the electronic component, a plate-type upper portion () parallel to the lower portion contacting a top surface () of the fins, and a connecting portion () interconnecting opposite two ends of the lower and upper portions. The heat pipe is configured in such a manner so as to enhance contact area and thermal conductivity between the heat pipe and the electronic component and between the heat pipe and the fins.

Vapor chamber heat sink

A heat dissipating device mounted onto a VGA card () includes a base () contacting with a GPU () attached on the VGA card, a cover () mounted on the base, and a plurality of fins () received between and thermally connecting the cover and the base. The base defines a slot () above the GPU. A fan () is positioned on the base for driving an airflow, wherein one portion of the airflow flows through the fins and another portion of the airflow flows through the slot and blows over other electronic components near to the GPU. Thus, rebounding of the airflow is reduced, and the heat dissipating device has better heat dissipating efficiency.

Growing community of inventors

Shenzhen, China

Jun-Hai Li