Hong Kong, China

Jun Cheng


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Innovations of Jun Cheng in Imaging Systems

Introduction

Jun Cheng is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of imaging systems, particularly in the area of three-dimensional reconstruction of surface profiles. His innovative approach has led to the development of a unique patent that enhances the accuracy and efficiency of surface profiling.

Latest Patents

Jun Cheng holds a patent for an "Imaging system for three-dimensional reconstruction of surface profiles." This system utilizes a binary pattern projected onto the surface of an object to achieve three-dimensional reconstruction. A binary string consisting of a series of '1's and '0's is created, and a corresponding binary pattern of light is projected onto the surface. The system captures images of the illuminated surface at various positions, allowing for the calculation of the height of predetermined points relative to a reference plane based on the cumulative images obtained.

Career Highlights

Jun Cheng is currently employed at Asm Assembly Automation Limited, where he continues to innovate and develop advanced imaging technologies. His work has positioned him as a key figure in the field of automation and imaging systems.

Collaborations

He collaborates with talented coworkers, including Chi Kit Ronald Chung and Y Edmund Lam, who contribute to the innovative projects at Asm Assembly Automation Limited.

Conclusion

Jun Cheng's contributions to imaging systems demonstrate his commitment to advancing technology in three-dimensional reconstruction. His patent reflects a significant step forward in the field, showcasing his inventive spirit and dedication to innovation.

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