Jui-Hsiang Hung

Title: Innovations of Jui-Hsiang Hung in Semiconductor Packaging

Introduction

Jui-Hsiang Hung is a notable inventor based in Chunghua, Taiwan, recognized for his contributions to semiconductor packaging technology. With a total of 6 patents to his name, he has made significant advancements in the field, particularly in improving the reliability and efficiency of semiconductor packages.

Latest Patents

One of his latest patents is titled "Method for fabricating semiconductor package with short-prevented lead frame." This innovation proposes a lead frame design where each lead is formed with a thickness-reduced portion at the peripheral position. This staggered arrangement of thickness-reduced portions between adjacent leads significantly increases the pitches, preventing lead bridging and short-circuiting during the singulation process. As a result, the quality of singulation and the overall product yield and reliability are effectively enhanced.

Another significant patent is "Lead-frame-based semiconductor package and fabrication method thereof." This patent describes a semiconductor package that includes a lead frame with multiple first and second leads. Each first lead features an extending portion that is thinner than the lead itself, allowing for a flush upper surface. A chip is mounted over these extending portions and is electrically connected to the leads via bonding wires. The package is encapsulated with a non-conductive material, ensuring that the lower surfaces of the leads remain exposed.

Career Highlights

Jui-Hsiang Hung is currently employed at Siliconware Precision Industries Co., Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packages, making them more efficient and reliable.

Collaborations

Throughout his career, Jui-Hsiang has collaborated with notable colleagues, including Chin-Teng Hsu and Chien-Ping Huang, who have contributed to his research and development efforts.

Conclusion

Jui-Hsiang Hung's innovative work in semiconductor packaging has led to significant advancements in the industry. His patents reflect a commitment to improving product reliability and efficiency, making him a key figure in the field of semiconductor technology.