Siliconware Precision Industries Co., Ltd.

Jui-Hsiang Hung

Chin-Teng Hsu

Chien-Ping Huang

Chih-Jen Yang

Chin-Yuan Hung

Holman Chen

Chin-Yuan Hong

Chang-Fu Chen

Cheng-Hsiung Yang

Chen-Hsiung Yang

Fu-Di Tung

Chen-Shih Yu

Jenn-Shyh Yu

A short-prevented lead frame and a method for fabricating a semiconductor package with the lead frame are proposed, wherein each lead of the lead frame is formed with a thickness-reduced portion at a peripheral position of the lead frame, allowing thickness-reduced portions of adjacent leads to be arranged in a stagger manner. This stagger arrangement significantly increases pitches between the neighboring thickness-reduced portions of leads. Therefore, during a singulation process as to cut through the leads, lead bridging and short-circuiting between adjacent leads caused by cut-side burrs can be prevented from occurrence, whereby singulation quality and product yield and reliability are effectively improved.

Method for fabricating semiconductor package with short-prevented lead frame

A lead-frame-based semiconductor package and a fabrication method thereof are proposed. The semiconductor package includes: a lead frame having a plurality of first and second leads, wherein each first lead is formed with an extending portion smaller in thickness than the first lead in a manner that, an upper surface of the extending portion is flush with an upper surface of the first lead, and a lower surface of the extending portion forms a height difference with respect to a lower surface of the first lead; a chip mounted over the upper surfaces of the extending portions, and electrically connected to the leads by bonding wires; an encapsulant for encapsulating the upper surfaces of leads, upper surfaces of extending portions, chip and bonding wires; and a non-conductive material applied over the lower surfaces of extending portions, wherein the lower surfaces of leads are exposed to outside of the non-conductive material.

Lead-frame-based semiconductor package and fabrication method thereof

Short-prevented lead frame and method for fabricating semiconductor package with the same

A multi-chip semiconductor package is proposed, in which a lead frame is formed with a chip carrier that consists of at least one supporting frame and a plurality of downwardly extending portions integrally formed with the supporting frame. As the chip carrier occupies small space, this does not impede flowing of a molding compound used for forming an encapsulant. The adjacent extending portions are provided with sufficient space therebetween for allowing the molding compound to flow through the space, so that problems of incomplete filling with the molding compound and the formation of voids can be eliminated. Moreover, the downwardly extending portions can function as a pre-stressed structure so as to closely abut a bottom of a mold cavity after mold engagement, thereby making the chip carrier well assured in position without being dislocated.

Multi-chip semiconductor package

In a dual-sided chip package without a die pad according to the invention, a first die can be fixed directly on the lead fingers of a leadframe, a support bar, or bus bars, while a second die is attached to the first die. Without a die pad, the distance between the surfaces of the dies and the plastic surface of the package therefore gets longer. Thus, the invention enables a large decrease in the probability of generating voids in the plastic and there is no need to grind the dies. Besides, it improves the vibration and floating characteristics of the dies in the manufacturing process and thus prevents the exposure of the bonding wires and the shelling off or breaking of the dies. The invention can raise the yield of chip packages.

Dual-sided chip package without a die pad

Growing community of inventors

Chunghua, Taiwan

Jui-Hsiang Hung