Jui Fu Hseih

Title: Innovations by Jui Fu Hseih

Introduction

Jui Fu Hseih is a notable inventor based in Zhubei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his expertise and innovative spirit. His work is primarily associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry.

Latest Patents

Jui Fu Hseih's latest patents include a method of manufacturing a semiconductor device and a semiconductor structure with shallow trench isolation. The first patent describes a detailed method where a first dielectric layer is formed over semiconductor fins, followed by the formation of a second dielectric layer that is recessed below the top of each semiconductor fin. This process continues with the creation of a third dielectric layer, which also is recessed, ultimately forming a wall fin that includes these layers. The method ensures that source/drain epitaxial layers are formed over the recessed semiconductor fins, separated by the wall fin. The second patent focuses on a semiconductor structure that includes a semiconductor substrate and shallow trench isolation, detailing the dimensions and interactions of the STI with the substrate.

Career Highlights

Throughout his career, Jui Fu Hseih has demonstrated a commitment to advancing semiconductor technology. His work at Taiwan Semiconductor Manufacturing Company Limited has positioned him as a key contributor to the development of innovative manufacturing processes and structures in the semiconductor field.

Collaborations

Jui Fu Hseih has collaborated with talented individuals such as Chia-Chi Yu and Yu-Li Lin, who have contributed to his projects and innovations. Their teamwork has fostered an environment of creativity and technical advancement.

Conclusion

Jui Fu Hseih's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative methods and structures continue to shape the future of semiconductor manufacturing.