Taichung, Taiwan

Jui-Feng Chen

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jui-Feng Chen. Retrieved from https://idiyas.com/inventor/jui-feng-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Innovations by Jui-Feng Chen

Introduction

Jui-Feng Chen is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging. His innovative approach has led to the development of a unique electronic package that enhances efficiency and reduces thickness.

Latest Patents

Jui-Feng Chen holds a patent for an "Electronic package and method for fabricating the same." This invention involves forming an antenna structure in contact with one side of a circuit structure of a packaging substrate. Additionally, it includes disposing an electronic component on the other side of the circuit structure. This integration of the antenna structure with the packaging substrate results in a thinner electronic package and improved antenna efficiency. He has 1 patent to his name.

Career Highlights

Jui-Feng Chen is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has allowed him to focus on advancing electronic packaging technologies. His contributions have been instrumental in enhancing product performance and efficiency.

Collaborations

Some of his coworkers include Chia-Cheng Chen and Chia-Cheng Hsu. Their collaboration has likely contributed to the innovative projects at Siliconware Precision Industries Co., Ltd.

Conclusion

Jui-Feng Chen's work in electronic packaging exemplifies the impact of innovation in technology. His patent reflects a commitment to improving efficiency in electronic devices. His contributions continue to shape the future of electronic packaging.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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