The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2019
Filed:
Aug. 18, 2017
Applicant:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Inventors:
Jui-Feng Chen, Taichung, TW;
Chia-Cheng Hsu, Taichung, TW;
Wen-Jung Tsai, Taichung, TW;
Chia-Cheng Chen, Taichung, TW;
Cheng Kai Chang, Taichung, TW;
Assignee:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 29/40 (2006.01); H01L 23/498 (2006.01); H01L 23/48 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 23/481 (2013.01); H01Q 1/2283 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract
An electronic package and a method for fabricating the same are provided. The method includes forming an antenna structure in contact with one side of a circuit structure of a packaging substrate, and disposing an electronic component on the other side of the circuit structure. As such, the antenna structure is integrated with the packaging substrate, thereby reducing the thickness of the electronic package and improving the efficiency of the antenna structure.