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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10431535 B1

PDFFull Text
Date of Patent:
Oct. 01, 2019

Filed:

Aug. 18, 2017

Electronic package and method for fabricating the same

Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Jui-Feng Chen, Taichung, TW;

Chia-Cheng Hsu, Taichung, TW;

Wen-Jung Tsai, Taichung, TW;

Chia-Cheng Chen, Taichung, TW;

Cheng Kai Chang, Taichung, TW;

Assignee:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Attorneys:

Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.

Peter F. Corless

Steven M. Jensen

Primary Examiner:

Calvin Lee

Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 29/40 (2006.01); H01L 23/498 (2006.01); H01L 23/48 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 23/481 (2013.01); H01Q 1/2283 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract

An electronic package and a method for fabricating the same are provided. The method includes forming an antenna structure in contact with one side of a circuit structure of a packaging substrate, and disposing an electronic component on the other side of the circuit structure. As such, the antenna structure is integrated with the packaging substrate, thereby reducing the thickness of the electronic package and improving the efficiency of the antenna structure.

Find Patent Forward Citations

Chen, Jui-Feng. (2019). Electronic package and method for fabricating the same (U.S. Patent No. 10431535). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10431535

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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