This inventor holds 4 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2003-2020.
Location History:
- Gilbert, AZ (US) (2003 - 2008)
- Beaverton, OR (US) (2020)
Company Filing History:
Years Active: 2003-2020
Title: Juan Landeros: Innovator in Electronic Packaging
Introduction
Juan Landeros is a notable inventor based in Gilbert, AZ (US). He has made significant contributions to the field of electronic packaging, holding a total of 4 patents. His work focuses on innovative solutions that enhance the functionality and efficiency of electronic assemblies.
Latest Patents
Landeros's latest patents include the "Reverse mounted gull wing electronic package," which features an electronic assembly with a substrate that has an aperture extending through it. This design allows the gull wing electronic package to be solder mounted within the aperture, optimizing space and functionality. Another significant patent is "Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same." This invention includes a mounting substrate with a passive component site and an active component site, incorporating a fluid flow barrier that effectively manages fluid dynamics during assembly.
Career Highlights
Juan Landeros is currently employed at Intel Corporation, where he continues to push the boundaries of electronic packaging technology. His innovative designs have contributed to the advancement of high-density electronic systems, making them more reliable and efficient.
Collaborations
Landeros has collaborated with talented coworkers such as Jason M Seitz and Mingjing Huang, further enhancing the innovative environment at Intel Corporation.
Conclusion
Juan Landeros is a prominent figure in the field of electronic packaging, with a strong portfolio of patents that reflect his innovative spirit. His contributions are paving the way for advancements in electronic assembly technologies.