The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2020
Filed:
Dec. 23, 2015
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Juan Landeros, Beaverton, OR (US);
Jason M. Seitz, San Francisco, CA (US);
Mingjing Huang, San Francisco, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/495 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49555 (2013.01); H05K 1/111 (2013.01); H05K 1/182 (2013.01); H05K 1/184 (2013.01); H05K 3/0011 (2013.01); H05K 3/3421 (2013.01); H01L 2924/1203 (2013.01); H05K 1/117 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/10174 (2013.01); H05K 2201/10651 (2013.01); H05K 2201/10757 (2013.01);
Abstract
An electronic assembly that includes a substrate having an aperture which extends through the substrate. The electronic assembly further includes a gull wing electronic package that includes leads which are solder mounted to the substrate such that the gull wing electronic package is within the aperture in the substrate, wherein the aperture is concentric with an exterior of the gull wing electronic package.