Company Filing History:
Years Active: 2020-2021
Title: Jason M Seitz: Innovator in Signal Processing and Electronic Packaging
Introduction
Jason M Seitz is a prominent inventor based in San Francisco, CA. He has made significant contributions to the fields of signal processing and electronic packaging. With a total of 3 patents to his name, Seitz continues to push the boundaries of technology through his innovative designs.
Latest Patents
One of Seitz's latest patents is focused on demodulating a signal from an intermittently illuminated region. This system is designed to intermittently illuminate a region, detect light from that region, and process the detected signal using a demodulator. The demodulator includes a capacitor, a resistor, and a switch that helps reduce the effects of low-frequency noise sources. This innovation is particularly useful in environments where background light and other noise can interfere with signal clarity.
Another notable patent by Seitz is for a reverse mounted gull wing electronic package. This electronic assembly features a substrate with an aperture that allows the gull wing electronic package to be solder mounted within it. This design enhances the efficiency and reliability of electronic assemblies, making it a valuable contribution to the field.
Career Highlights
Jason M Seitz is currently employed at Intel Corporation, where he applies his expertise in electronics and signal processing. His work at Intel has allowed him to collaborate with some of the brightest minds in the industry, further enhancing his innovative capabilities.
Collaborations
Seitz has worked alongside talented colleagues such as Mingjing Huang and Matthew D Pickett. These collaborations have fostered an environment of creativity and innovation, leading to the development of cutting-edge technologies.
Conclusion
In summary, Jason M Seitz is a distinguished inventor whose work in signal processing and electronic packaging has made a significant impact on the technology landscape. His patents reflect a commitment to innovation and excellence in engineering.