Joseph Piccirillo, Jr

Title: Joseph Piccirillo, Jr.: Innovator in Semiconductor Technology

Introduction

Joseph Piccirillo, Jr. is a notable inventor based in Clifton Park, NY (US). He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to device integration.

Latest Patents

His latest patents include an "Apparatus and method for integration of through substrate vias" and a "Method for thin die-to-wafer bonding." The first patent provides an apparatus that integrates through substrate vias (TSVs) into devices before processing device contacts. This apparatus features a semiconducting layer with CMOS devices mounted on its surface, along with integrated TSVs and metal layers designed for optimal bonding. The method outlined in this patent involves several processing steps on a wafer of semiconducting material to ensure effective integration of TSVs.

The second patent details a method for bonding a die to a base technology wafer. This process includes providing a device wafer and a carrier wafer, bonding them with adhesive, and subsequently processing the device wafer to create a backside redistribution layer. The method culminates in the dicing of the device wafer into individual die and bonding them to the base technology wafer.

Career Highlights

Joseph Piccirillo, Jr. is affiliated with the State University of New York, where he continues to advance research in semiconductor technologies. His work has been instrumental in developing methods that enhance the efficiency and performance of electronic devices.

Collaborations

He collaborates with esteemed colleagues such as Daniel Pascual and Douglas Duane Coolbaugh, contributing to a dynamic research environment that fosters innovation.

Conclusion

Joseph Piccirillo, Jr. exemplifies the spirit of innovation in the semiconductor industry through his patents and collaborative efforts. His work continues to influence the development of advanced technologies in this critical field.