Morgan Hill, CA, United States of America

Joseph O Smith

This inventor holds 29 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: National Semiconductor Corporation, Other. Active years: 1980-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Joseph O Smith. Retrieved from https://idiyas.com/inventor/joseph-o-smith

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.9

ph-index = 16

Forward Citations = 1,284(Granted Patents)


Location History:

  • Glennie, MI (US) (1980)
  • Morgan Hill, CA (US) (1997 - 2008)
  • Wellington, FL (US) (2014)

Company Filing History:


Years Active: 1980-2014

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Areas of Expertise:
Semiconductor Device
Multichip Packages
Ball Grid Array
Opto-Electronic Device
Lead Frame
Chip Scale Package
Integrated Circuits
Wafer Level Molding
Thermal Management
PCB Mounting
Exposed Die
Stackable Package
29 patents (USPTO):Explore Patents

Title: Innovations of Joseph O. Smith: A Pioneer in Opto-Electronic Devices

Introduction

Joseph O. Smith, based in Morgan Hill, California, is a distinguished inventor renowned for his contributions in the field of opto-electronics. With a remarkable portfolio of 27 patents, Smith's innovative work primarily focuses on enhancing semiconductor technologies, particularly in the packaging and functionality of opto-electronic devices.

Latest Patents

Among Smith's latest inventions is the "Die-level opto-electronic device and method of making same." This patent involves a sophisticated design featuring a semiconductor die and a photonic device, which integrates a conductive structure away from the die's edges for enhanced performance. The opto-electronic device also boasts an optically transparent laminate that overlays the photonic device. Furthermore, the invention encompasses semiconductor wafers with multiple photonic devices exposed on one surface and conductive structures on the opposing surface, all aiming to improve the efficiency of opto-electronic functionalities.

Additionally, Smith's patent titled "Packaging of a semiconductor device with a non-opaque cover" introduces a novel packaging solution. This invention allows for the use of an encapsulant combined with a non-opaque cover. The design ensures that while the bonding pads are exposed, the imaging portion of the die remains sealed, preventing any encapsulant from contacting sensitive components. This innovation is instrumental in maintaining the integrity and functionality of semiconductor devices.

Career Highlights

Joseph O. Smith currently works at National Semiconductor Corporation, where he has made significant advancements in semiconductor technology. His career has been marked by a commitment to innovation, pushing the boundaries of what is possible in opto-electronic applications. His extensive patent portfolio is a testament to his creativity and technical expertise in this specialized field.

Collaborations

Throughout his career, Smith has collaborated with notable professionals, including Shahram Mostafazadeh and Luu Thanh Nguyen. These partnerships have fostered a collaborative environment that encourages pioneering inventions and advancements in technology, underscoring the importance of teamwork in the innovation process.

Conclusion

Joseph O. Smith's work exemplifies innovation in the sphere of opto-electronic devices. His patents not only contribute to the advancement of semiconductor technology but also reflect his dedication to solving complex engineering challenges. As the field continues to evolve, Smith's inventions will undoubtedly play a critical role in shaping the future of opto-electronic applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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