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For the Inventor, By the Inventor

Endicott, NY, United States of America

Joseph Maryan Milewski

This inventor holds 11 USPTO granted patents. Top assignees: International Business Machines Corporation, Other. Active years: 1982-2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Joseph Maryan Milewski. Retrieved from https://idiyas.com/inventor/joseph-maryan-milewski

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 11

% Patents Active = 63.6

Average Co-Inventor Count = 2.8

ph-index = 9

Forward Citations = 255(Granted Patents)


Location History:

  • Philadelphia, PA (US) (1982)
  • Binghamton, NY (US) (1994 - 2001)
  • Endicott, NY (US) (2001 - 2004)
  • Kirkwood, NY (US) (2001 - 2006)

Company Filing History:

goldMedal10 out of 166,425 
 
International Business Machines Corporation
 patents
silverMedal1 out of 834,601 
Other
 patents

Years Active: 1982-2006

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11 patents (USPTO):Explore Patents
1. 6994243 - Low temperature solder chip attach structure and process to produce a high temperature interconnection (2006-02-07),
2. 6847118 - Low temperature solder chip attach structure (2005-01-25),
3. 6806563 - Composite capacitor and stiffener for chip carrier (2004-10-19),
4. 6441670 - 5V-tolerant receiver for low voltage CMOS technologies (2002-08-27),
5. 6362653 - High voltage tolerant receivers (2002-03-26),
6. 6330967 - Process to produce a high temperature interconnection (2001-12-18),
7. 6326696 - Electronic package with interconnected chips (2001-12-04),
8. 6306686 - Method of fabricating an electronic package with interconnected chips (2001-10-23),
9. 6262599 - Level shifting CMOS I/O buffer (2001-07-17),
10. 5367435 - Electronic package structure and method of making same (1994-11-22),
11. 4313110 - Smoke alarm having temporary disabling features (1982-01-26),

Title: Joseph Maryan Milewski: Innovator in Low Temperature Solder Technology

Introduction

Joseph Maryan Milewski is an accomplished inventor based in Endicott, NY, with an impressive portfolio of 10 patents. His work primarily focuses on innovative soldering technologies that enhance electronic manufacturing processes.

Latest Patents

Among his latest patents, Milewski developed a low temperature solder chip attachment structure and a process to produce a high temperature interconnection. This invention employs lead-rich solder balls to facilitate low temperature chip attachment directly onto higher levels of packaging substrates. The patented process includes forming a solder ball with standard techniques, followed by depositing a thin layer of pure tin on the solder balls' surfaces. Upon reflow, an interconnecting eutectic alloy forms, and subsequent annealing allows for the diffusion of tin into the lead, thus increasing the melting point temperature of the assembly's cap layer. This innovative structure effectively mitigates secondary reflow issues during subsequent processing.

Career Highlights

Milewski’s career is prominently linked to his role at the International Business Machines Corporation (IBM), where he has contributed significantly to advancing solder technology. His expertise has supported various advancements in electronics, particularly in enhancing the reliability and performance of electronic components.

Collaborations

His accomplishments in the field are further highlighted by his collaborations with notable coworkers such as Charles Gerard Woychik and Terry Cain Coughlin, Jr. Together, they have contributed to innovative research and development efforts in solder technology.

Conclusion

Joseph Maryan Milewski stands out as a prominent figure in the field of solder technology innovation. His patents reflect a commitment to advancing electronic manufacturing techniques, particularly through low temperature solder applications. With his contributions, Milewski continues to support the evolution of reliable and effective electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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