Joseph G Coones

Title: Joseph G Coones: Innovator in Engineered Substrate Assemblies

Introduction

Joseph G Coones is a notable inventor based in Boise, ID (US). He has made significant contributions to the field of semiconductor technology through his innovative patents. His work primarily focuses on engineered substrate assemblies that utilize thermally opaque materials.

Latest Patents

Joseph G Coones holds a patent for "Engineered substrate assemblies with thermally opaque materials, and associated systems, devices, and methods." This patent describes engineered substrates designed to prevent the transmission of radiative energy during epitaxial growth processes. The invention includes methods for separating substrates from epitaxially grown semiconductor structures. In various embodiments, the engineered substrate is manufactured by forming a thermally opaque material on the upper surface of a handle substrate. This design allows for improved accuracy in epitaxy process temperature measurements and enhances the uniformity of epitaxy growth characteristics across the substrate.

Career Highlights

Joseph G Coones is associated with Micron Technology Incorporated, a leading company in the semiconductor industry. His work at Micron has allowed him to contribute to advancements in semiconductor manufacturing processes. His innovative approach has garnered attention within the industry, showcasing his expertise in the field.

Collaborations

Joseph has collaborated with Jeremy S Frei, working together to advance their projects and innovations in semiconductor technology.

Conclusion

Joseph G Coones is a prominent inventor whose work in engineered substrate assemblies has made a significant impact on semiconductor technology. His innovative patent reflects his dedication to improving manufacturing processes and enhancing the accuracy of semiconductor growth.