Jose V Siles

Title: Innovations of Inventor Jose V Siles

Introduction

Jose V Siles is a notable inventor based in Pasadena, CA. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and functionality of electronic devices through innovative methods and designs.

Latest Patents

One of his latest patents is the "Wafer-to-wafer alignment method." This invention utilizes a silicon alignment pin to align successive layers of components made in semiconductor chips and/or metallic components. The design simplifies the assembly of devices with layered structures. The pin is a compressible structure that can be squeezed to reduce its outer diameter, allowing it to fit into an alignment pocket or cavity in a layer of material. Once in place, it expands to create an interference fit, ensuring precise alignment between multiple layers.

Another significant patent is the "340 GHz multipixel transceiver." This invention features a multi-pixel terahertz transceiver constructed from a stack of semiconductor layers. The design allows for easy testing of various electrical functions without the need to assemble the entire transceiver. Additionally, it enables the production of a transceiver with pixels spaced 10 mm apart, enhancing its performance and versatility.

Career Highlights

Jose V Siles is affiliated with the California Institute of Technology, where he continues to push the boundaries of semiconductor technology. His innovative approaches have garnered attention in the field, contributing to advancements in electronic device assembly and functionality.

Collaborations

Throughout his career, Jose has collaborated with esteemed colleagues, including Cecile D Jung-Kubiak and Theodore J Reck. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Jose V Siles is a prominent inventor whose work in semiconductor technology has led to significant advancements in electronic device assembly. His patents reflect a commitment to innovation and efficiency, making him a valuable contributor to the field.