Company Filing History:
Years Active: 2018-2025
Title: Inventor Jorge Luis Rosales: A Pioneer in Thermal Management Technologies
Introduction
Jorge Luis Rosales, based in San Diego, CA, is a notable inventor known for his advancements in thermal management systems for electronic devices. With a total of 13 patents to his name, Rosales continues to innovate in the field of head-mounted displays, particularly focusing on heat dissipation methods that enhance device performance and usability.
Latest Patents
Rosales' latest inventions include two groundbreaking patents: "Head-mounted display device incorporating piezo-electric device for heat dissipation" and "Head-mounted electronic device incorporating a piezo-electric device for dissipation of heat." These patents introduce innovative methods for controlling piezo-electric devices integrated into head-mounted electronic devices. The described systems effectively draw heated air away from critical components, such as integrated circuits (ICs), to maintain optimal thermal conditions and prevent overheating. This technology not only improves the performance of head-mounted devices but also contributes to user comfort by managing skin temperature limits.
Career Highlights
Currently, Jorge Rosales is associated with Qualcomm Incorporated, a leading technology company renowned for its contributions to telecommunications and mobile communications. Throughout his career, Rosales has demonstrated a commitment to addressing thermal challenges in electronics, positioning himself as a crucial figure in the ongoing evolution of head-mounted display technologies.
Collaborations
Rosales has collaborated with esteemed colleagues, including Victor Adrian Chiriac and Peng Wang. Together, they have combined their expertise to drive innovation in thermal management solutions, supporting the development of cutting-edge electronic devices that users across the globe can rely on.
Conclusion
Jorge Luis Rosales exemplifies the spirit of innovation through his work in developing effective heat dissipation technologies for head-mounted electronic devices. With a strong portfolio of patents and valuable collaborations, his contributions significantly impact the performance and comfort of electronic devices, ensuring they meet the growing demands of modern users.