Qualcomm Incorporated

Jorge Luis Rosales

Victor Adrian Chiriac

Peng Wang

Jon James Anderson

Le Gao

Stephen A Molloy

Don Le

Sean Charles Andrews

Mario Francisco Velez

Kenneth W Baar

Jen-Chun Chang

Ajit Kumar Vallabhaneni

Jose Gilberto Corleto Mena

Sin-Shong Wang

Hung-Wen Lin

Qiang Du

Stephen Arthur Molloy

Head-mounted electronic device incorporating a piezo-electric device for dissipation of heat, and related methods of controlling the piezo-electric device to dissipate heat from the head-mounted electronic device are disclosed. To dissipate heat in the head-mounted electronic device, the piezo-electric device is integrated in the head-mounted electronic device and is fluidly coupled to an internal air chamber in the head-mounted electronic device that in fluid communication with an integrated circuit (IC). The piezo-electric device draws the heated air around the IC into the internal chamber that heats air inside the internal chamber. The piezo-electric device is configured to pump heated air in the internal chamber through an outlet to dissipate the heated air from the internal chamber. Dissipation of heated air heated from heat generated from the IC can keep the IC from exceeding its thermal limits and/or prevent the head-mounted electronic device from exceeding its skin temperature limit.

Head-mounted display device incorporating piezo-electric device for heat dissipation, and related methods

An electronic device that includes a first device portion, a second device portion coupled to the first device portion; and a thermally conductive connector coupled to the first device portion and the second device portion, wherein the thermally conductive connector includes a graphite sheet. The first device portion includes a region that includes a component configured to generate heat.

Electronic device comprising a thermally conductive connector comprising graphite

A device that includes a region comprising a heat generating device, and an energy harvesting device coupled to the region comprising the heat generating device. The energy harvesting device includes a first thermal conductive layer, a thermoelectric generator (TEG) coupled to the first thermal conductive layer, and a second thermal conductive layer coupled the thermoelectric generator (TEG) such that the thermoelectric generator (TEG) is between the first thermal conductive layer and the second thermal conductive layer. In some implementations, the energy harvesting device includes an insulation layer.

Energy harvesting device for electronic devices

Aspects of the disclosure relate to thermal management of devices, such as mobile devices configured for wireless communication in wireless communication networks. A device includes a plurality of electronic components. An electromagnetic interference (EMI) shield is disposed on the electronic components, and a plurality of EMI gaskets are disposed between the electronic components. Each of the EMI gaskets surrounds a respective one of the plurality of electronic components. An evaporative cooler device embedded within the EMI shield is configured to transfer heat away from at least a portion of the electronic components.

Device thermal management

Certain aspects of the present disclosure generally relate to techniques for cooling electronic devices using thermosiphons having one or more micro-pumps at least partially disposed therein. A provided thermosiphon generally includes a fluid; a first evaporator configured to evaporate the fluid, wherein the first evaporator has an inlet and an outlet; a first condenser configured to condense the fluid, wherein the first condenser has an inlet and an outlet; a first channel coupled between the outlet of the first evaporator and the inlet of the first condenser; a second channel coupled between the outlet of the first condenser and the inlet of the first evaporator; and a first micro-pump located in the second channel and operable to pump the fluid in the second channel from the first condenser to the first evaporator.

Enhanced cooling of an electronic device using micropumps in thermosiphons

An example heat-dissipating device with enhanced interfacial properties generally includes a first heat spreader configured to be thermally coupled to a region configured to generate heat, a second heat spreader, an interposer thermally coupled to at least one of the first heat spreader or the second heat spreader, at least one interfacial layer including a graphene material disposed on at least one surface of the interposer, and a phase change material disposed between the at least one interfacial layer and at least one of the first heat spreader or the second heat spreader and thermally coupled to at least one of the first heat spreader or the second heat spreader.

Heat-dissipating device with interfacial enhancements

A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.

Multi-phase heat dissipating device comprising piezo structures

Techniques for heat reduction are disclosed. An apparatus may include a heat-generating component, an insulative layer having a first surface in contact with the heat-generating component and a second surface opposite the first surface, and a heat-conducting component disposed on the second surface of the insulative layer.

Heat reduction using selective insulation and thermal spreading

A quad-rotor or other unmanned aerial drone having a planar vapor chamber mounted to a processor of the drone to cool the processor. The processor may be enclosed in a protective central housing. The vapor chamber is mounted, in some examples, with a perimeter of the vapor chamber extending from the processor through the housing into an airflow region near the rotors of the drone so that airflow, which may include propeller wash, serves to cool the perimeter of the vapor chamber. The planar vapor chamber cools the enclosed processor using both phase-change cooling/heat spreading (i.e. heat is dissipated from the processor via evaporation and subsequent condensation) and convection (i.e. airflow passing over the perimeter of the vapor chamber carries heat away).

Multi-rotor aerial drone with vapor chamber

Some features pertain to an apparatus that includes a first heat spreader and a second heat spreader, a matrixed heat spreader, the matrixed heat spreader including a first plurality of portions perpendicular to a second plurality of portions, the first plurality of portions intersects the second plurality of portions, and a phase change material (PCM) located in a plurality of reservoirs defined by the matrixed heat spreader.

Method and apparatus for cooling of an electronic device

A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, wherein the evaporation portion is at least partially defined by the inner wall, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator, wherein the collection portion is at least partially defined by the inner wall. The heat dissipating device may be a multi-phase heat dissipating device.

Multi-phase heat dissipating device for an electronic device

A device that includes a region comprising an integrated device and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a first condenser configured to condense the fluid, where the first condenser is located in a first wall of the device, an evaporation portion coupled to the evaporator and the first condenser, and a collection portion coupled to the first condenser and the evaporator. The evaporation portion is configured to channel an evaporated fluid from the evaporator to the first condenser. The collection portion is configured to channel a condensed fluid from the first condenser to the evaporator through the help of gravity.

Multi-phase heat dissipating device embedded in an electronic device

A heat dissipating device that includes a first heat spreader layer, a second heat spreader layer, a first spacer, a second spacer, a first phase change material (PCM), and a second phase change material (PCM). The first heat spreader layer includes a first spreader surface and a second spreader surface. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The first spacer is coupled to the first heat spreader layer and the second heat spreader layer. The second spacer is coupled to the first heat spreader layer and the second heat spreader layer. The first PCM is located between the first heat spreader layer and the second heat spreader layer. The first PCM is surrounded by the first spacer. The second PCM is between the first heat spreader layer, the second heat spreader layer, the first spacer and the second spacer.

Growing community of inventors

San Diego, CA, United States of America

Jorge Luis Rosales